Communication Module

Reliable Connectivity/ Automotive Grade

CLIENT INDUSTRY

Automotive/Telematics&Connectivity

PCB LAYERS

8-Layer HDI

BOARD SIZE

80mm×60mm

OPERATING TEMPERATURE

-40°℃~+125°℃

Communication Module layout

FINISHED PCB

3DVIEW

DESIGN HIGHLIGHTS

HIGH SPEED COMMUNICATION

Supports Ethernet, CAN FD,FlexRay, and high-speedserial interfaces.

AUTOMOTIVE RELIABILITY

AEC-Q100 compliant designfor extreme temperatureand vibration.

SIGNAL INTEGRITY

Optimized impedance controland length matching forhigh-speed differential pairs.

POWER MANAGEMENT

Efficient power architecturewith low EMI and highnoise immunity.

COMPACT & INTEGRATED

High-density HDI layoutminimizes size and maximizes performance.

TECHNICALSPECIFICATIONS

  • Layer Count:8-Layer HDI
  • Base Material: FR-4/ High Tg
  • Surface Finish: ENIG
  • Min. Line/Space: 4/4 mil
  • Board Thickness: 1.20 mm ± 10%
  • Via Types:Blind /Buried/ Stacked Microvia

KEYINTERFACES

  • CANFD
  • LIN
  • FlexRay
  • GNSS
  • Ethernet100BASE-T1
  • SPI/I2C/UART
  • ADC/PWM/GPIO
  • USB 2.0

READYFOR

  • Mass Production
  • Automotive Grade
  • Quality Assured