Land-Pattern Review
Pad geometry, solder mask, via-in-pad and package data reviewed before production setup.
Precision printing, placement, reflow and X-ray verification for BGA, QFN, CSP, LGA and other high-density packages.
Control below the component
BGA and fine-pitch packages demand accurate land patterns, consistent solder-paste deposition, stable placement and a controlled thermal profile. Our process combines engineering review with in-line inspection and X-ray verification to manage voiding, opens, bridges and alignment risk.
Process capabilities
Pad geometry, solder mask, via-in-pad and package data reviewed before production setup.
Aperture shape, reduction, thickness and step-stencil needs optimized for balanced paste volume.
Paste height, area and volume checked before component placement to prevent downstream defects.
Package recognition, fiducial alignment and placement parameters controlled for dense assemblies.
Ramp, soak, peak temperature and time above liquidus tuned to board mass and component limits.
Hidden solder joints assessed for alignment, voiding, bridges, opens and head-in-pillow indicators.
Controlled workflow
Package support
Defect prevention & recovery
Frequently asked questions
Please provide Gerber or ODB++ data, BOM, pick-and-place files, assembly drawings, package datasheets and any acceptance criteria for voiding or X-ray inspection.
Because BGA joints are hidden, X-ray is strongly recommended for first articles, new processes, rework and applications where joint quality cannot be verified visually.
Yes. The same engineering controls can be applied to prototype, NPI and repeat production builds, with inspection depth adjusted to project risk and requirements.