AUTOMOTIVE CONTROL MODULE
High-Performance.Reliable.Automotive-Grade.
CLIENTINDUSTRY
Automotive/Powertrain&ChassisControl
PCBLAYERS
10-Layer HDI
BOARDSIZE
160mm×100mm
OPERATINGTEMPERATURE
-40°℃~+125°℃
FINISHED PCB
TOP VIEW
3DVIEW
FINISHED PCB
（BOTTOMVIEW)
DESIGN HIGHLIGHTS
HIGH SPEED SIGNAL INTEGRITY
Optimized stackup and routing for CAN FD,LIN, and Ethernet.
AUTOMOTIVE RELLABILITY
AEC-Q100 compliant designfor extreme temperatureand vibration.
POWER MANAGEMENT
Multi-rail power deliverywith low EMI and highefficiency.
FUNCTIONAL SAFETY
Support ISO 26262functional safetyrequirements.
COMPACT&INTEGRATED
High-density HDI layoutminimizes size andmaximizes performance.
TECHNICALSPECIFICATIONS
- Layer Count:10-Layer HDI(2-2-2-2-2)
- Base Material: FR-4/ High Tg
- Surface Finish: ENIG
- Min. Line/Space: 4/4 mil
- Copper Weight:1oz (Inner)/ 2oz(Outer)
- Via Types:Blind /Buried/ Stacked Microvia
KEYINTERFACES
- CANFD
- LIN
- FlexRay
- Ethernet100BASE-T1
- SPI/I2C/UART
- ADC/PWM/GPIO
READYFOR
- Mass Production
- Automotive Grade
- Quality Assured