AUTOMOTIVE CONTROL MODULE
High-Performance.Reliable.Automotive-Grade.
CLIENTINDUSTRY
Automotive/Powertrain&ChassisControl
PCBLAYERS
10-Layer HDI
BOARDSIZE
160mm×100mm
OPERATINGTEMPERATURE
-40°℃~+125°℃
FINISHED PCB
3DVIEW
DESIGN HIGHLIGHTS
HIGH-PERFORMANCEMCU
Powerful 32-bit automotive-grade MCU for real-time control and computation
AUTOMOTIVE COMMUNICATION
Multiple CAN FD, LIN, FlexRay interfaces ensure reliable in-vehicle communication
POWER MANAGEMENT
Optimized power architecture with wide voltage input and protection
FUNCTIONAL SAFETY
Designed to support IS026262 compliance and ASlL requirements
COMPACT&INTEGRATED
High-density HDI layout minimizes size and maximizes performance
TECHNICALSPECIFICATIONS
- Layer Count:10-Layer HDI
- Base Material: FR-4/ High Tg
- Surface Finish: ENIG
- Min. Line/Space: 4/4 mil
- Copper Weight:1oz (Inner)/ 2oz(Outer)
- Via Types:Blind /Buried/ Stacked Microvia
KEYINTERFACES
- CANFD
- LIN
- FlexRay
- Ethernet100BASE-T1
- SPI/I2C/UART
- ADC/PWM/GPIO
READYFOR
- Mass Production
- Automotive Grade
- Quality Assured