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What is BGA in SMT chip processing?
SMT chip processing BGA is a packaging method, BGA is the abbreviation of English BallGridArray, translated into Chinese as ball grid array packaging.
ith the continuous development of electronic technology in the 1990s, IC processing speed has also continued to increase. The number of I/O pins on integrated circuit chips has continued to increase, and various levels of factors have clearly proposed higher IC packaging.
In addition, in order to consider the development of electronic equipment toward miniaturization and precision, BGA packaging has been introduced and capital is put into production.
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