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PCB MANUFACTURING SERVICES

PCB Manufacturing Services for Prototypes and Production

PCB fabrication support for multilayer, HDI, RF, rigid-flex, heavy copper and controlled-impedance boards, with engineering review and production support from prototype through production.

Engineering ReviewPrototype to ProductionQuality CoordinationProject Delivery

PCB Technologies

PCB Types We Support

PCB manufacturing requirements are matched to the board technology, material system, stack-up, quantity and inspection requirements of each project.

RF / High-Frequency PCB

PCB fabrication support for RF and microwave designs requiring suitable high-frequency materials and controlled impedance.

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Rigid-Flex PCB

Rigid-flex PCB support for compact assemblies combining rigid and flexible circuit structures.

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Controlled-Impedance PCB

Controlled-impedance fabrication with stack-up, material and impedance requirements reviewed before production.

Flexible PCB

Flexible circuit support using polyimide constructions for space-constrained and dynamic interconnect applications.

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Metal Core PCB

Aluminum and metal-core PCB support for thermal management in LED, power and industrial electronics.

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Technical Overview

PCB Manufacturing Capabilities

The table summarizes confirmed capabilities already documented across the manufacturing service pages. Final capability is verified against the complete project data before quotation and production.

Layer Count2–32 layers, depending on board technology and stack-up.
PCB MaterialsFR-4, high-Tg FR-4, high-frequency laminates, polyimide and aluminum / metal-core systems.
Board ThicknessProject-specific; multilayer support up to 5.0 mm is documented, subject to stack-up review.
Copper ThicknessProject-specific; standard, heavy-copper and metal-core copper requirements are reviewed before production.
Minimum Line / SpaceConfirmed after DFM review according to board technology, copper and fabrication requirements.
Minimum Hole / ViaConfirmed after DFM review according to drill structure, aspect ratio and PCB technology.
Via TypeThrough, blind and buried vias, microvias and via-in-pad where applicable.
HDI Structure1+N+1 and 2+N+2 structures are documented; project stack-up is reviewed before production.
Controlled ImpedanceSingle-ended and differential requirements, with stack-up and verification requirements defined by project specifications.
Surface FinishHASL, lead-free HASL, ENIG, OSP, immersion silver and immersion tin.
Solder MaskColor, type and special requirements are confirmed against project specifications.
TestingAOI, electrical / flying-probe testing, X-ray, microsection and impedance testing as applicable.
Special ProcessesHDI microvias, heavy copper, rigid-flex, flexible circuits, controlled impedance and metal-core construction.

Material Selection

PCB Materials

Material selection is matched to electrical performance, thermal requirements, frequency, stack-up and reliability requirements.

FR-4General multilayer and standard PCB applications.
High-Tg FR-4Selected where thermal and reliability requirements call for higher glass-transition performance.
High-Frequency LaminatesRogers, Taconic and Isola laminate families are documented for relevant RF requirements.
PolyimideFlexible and rigid-flex circuit constructions.
Aluminum / Metal CoreThermally managed PCB applications.
Project-Specific SelectionFinal material and availability are confirmed during engineering and manufacturing review.

Assembly Interface

PCB Surface Finishes

Surface finish is selected according to component pitch, assembly process, storage, reliability and application requirements.

ENIGGood surface flatness for fine-pitch assembly requirements.
HASLA cost-effective option for conventional PCB applications.
Lead-Free HASLA lead-free finish option for suitable assembly requirements.
OSPA flat organic finish for compatible soldering and handling requirements.
Immersion SilverA flat finish available for suitable high-frequency and assembly applications.
Immersion TinA flat finish documented for applicable flexible and rigid-flex requirements.

Signal Integrity

Controlled Impedance PCB Manufacturing

Controlled-impedance requirements are reviewed together with PCB stack-up, trace geometry, copper thickness, dielectric materials and fabrication tolerances before production.

  • Stack-Up Review
  • Material Selection
  • Trace Geometry
  • Single-Ended Impedance
  • Differential Impedance
  • Impedance Verification When Specified

Quality Planning

PCB Inspection & Testing

Inspection and testing requirements are selected according to PCB technology, project specifications and production requirements.

AOIAutomated optical inspection of PCB features.
Electrical / Flying ProbeElectrical verification for applicable bare-board requirements.
X-Ray InspectionInspection support for hidden structures and registration where applicable.
Microsection AnalysisCross-section review of layer and plated structures when required.
Impedance TestingVerification according to specified controlled-impedance requirements.
Final Quality ReviewReview of inspection documentation and project acceptance requirements before delivery.

Volume Support

From Prototype to Production

Excel Circuit supports the PCB manufacturing process from early engineering prototypes and low-volume builds through repeat production requirements.

PrototypeEngineering and design-verification builds.
Low-VolumeSmall production runs for testing, validation and early market requirements.
Pilot ProductionProcess verification before repeat production.
ProductionOngoing manufacturing support according to controlled specifications, quality and delivery requirements.

Engineering-Led Support

Engineering Review Before Production

Before production, our team reviews PCB files and manufacturing requirements to identify potential issues involving stack-up, materials, impedance, drill structures, tolerances and manufacturability.

  • Gerber & Fabrication Drawing Review
  • Stack-Up & Material Review
  • Copper Weight & Impedance Review
  • Hole / Via Review
  • DFM Review
  • Special Process & Manufacturing Risk Review

Project Management

How We Manage PCB Manufacturing

Excel Circuit manages engineering review, manufacturing capability matching, production coordination, quality requirements and delivery around the technical and commercial needs of each project.

File & Requirement Review

Review Gerber files, drawings, stack-up, materials, copper, impedance and specifications.

Manufacturing Capability Matching

Match PCB technology, materials, volume, lead time and quality requirements.

Engineering & DFM Review

Review manufacturability and clarify technical issues before fabrication.

Production, Inspection & Testing

Coordinate fabrication, inspection and testing according to project specifications.

Quality Review & Delivery

Manage quality requirements, production status, documentation, packaging and delivery.

Connected Services

Engineering and Assembly Support

Manufacturing risks can be addressed with PCB engineering support, while complete PCBA projects can continue through component sourcing and in-house SMT assembly.

Purchasing FAQ

PCB Manufacturing Frequently Asked Questions

Practical answers about files, schedule, engineering support, production coordination and confidentiality.

What files do you need for PCB Manufacturing?

For a PCB Manufacturing quotation, send Gerber or ODB++ data, NC drill files, fabrication drawing, layer stackup, material and copper requirements, surface finish, controlled-impedance details, quantity, and required delivery date.

What is the typical lead time for PCB Manufacturing?

Lead time depends on design maturity, complexity, quantity, material or component availability, testing scope, and how quickly engineering questions are resolved. We confirm the schedule after reviewing your files; urgent prototype or quick-turn options can be discussed where the required process and materials permit.

Which EDA tools and file formats are supported?

Gerber and ODB++ are the preferred neutral production formats. If your source data is in a native EDA tool, tell us the software and version; we will confirm compatibility or ask for a controlled Gerber/ODB++ export, drill data, drawings and other release files.

Can you handle an existing design or previous revision?

Yes. We can work from an existing design, production package or previous revision. We first check completeness, revision control and the requested scope, then identify any missing data, manufacturability risks or changes that need your approval before work begins.

Do you provide signal integrity and power integrity analysis?

Yes, SI/PI analysis can be coordinated when manufacturing or assembly risk depends on controlled impedance, return paths or power integrity. It is a separate engineering scope and requires suitable design data, stackup information, models and acceptance criteria.

Can you coordinate fabrication and assembly?

Yes. Excel Circuit can coordinate fabrication, component sourcing, PCB assembly, inspection, testing and related box-build work as one project. The quotation states which stages are included, which materials are consigned, and the approvals needed before production.

How is design confidentiality protected?

Project files are limited to personnel and qualified partners who need them for quotation and delivery. Excel Circuit uses reasonable technical and organizational safeguards, does not publish customer designs without permission, and can work under a mutually agreed NDA. Your signed NDA or project agreement controls where it provides specific protections.

Final scope, price and lead time are confirmed after engineering review of your current files and requirements.