Featured Article
Embedded & FPGA PCB Design: From Architecture to Reliable Bring-Up
A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
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A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
Read Featured Article
A clear, practical 22-step enterprise PCB design workflow covering project inputs, component placement, stack-up planning, routing, verification, Gerber review and production-ready file archiving.
Engineering guidelines for high-current PCB layout covering copper paths, via arrays, switching loops, heat spreading, safety spacing and manufacturing.
Engineering guidelines for FPGA power integrity, PDN design, decoupling placement, BGA power delivery, plane transitions, sequencing and PI validation.
An engineering guide to PCB stackup design covering layer functions, reference planes, power distribution, materials, controlled impedance, via architecture, construction balance and manufacturing DFM.
Engineering guide to 50-ohm RF PCB traces covering microstrip, stripline, coplanar waveguide, stack-up variables, connector transitions and fabrication tolerance.
An engineering guide to BGA fanout covering escape-channel planning, dog-bone routing, via-in-pad, microvias, stack-up coordination, return paths, power delivery and manufacturing DFM.
Engineering-focused DDR PCB routing guidelines covering topology, timing budgets, byte-lane constraints, length matching, impedance, return paths, SI/PI and manufacturing review.
A practical engineering guide to Embedded & FPGA PCB design, from architecture and power sequencing to DDR routing, SI/PI verification, DFM, and board bring-up.
Engineering guide to via-in-pad PCB design covering fine-pitch BGA escape, microvias, VIPPO filling and capping, soldering risk, cost and DFM.
A practical engineering guide to RF PCB layout, controlled impedance, low-loss materials, grounding, transitions, simulation, testing, and manufacturable high-frequency designs.
Liquid crystal display (LCD) and touchscreen technology have become core components of various electronic devices, from smartphones to televisions and medical devices. Among these devices, PCB design is
This article will take you from a beginner’s perspective to quickly understand the commonly used basic concepts in PCB design
Board-to-Board Connector；BTB；component
Excel Circuit, which specializes in high multilayer PCB, rigid flex PCB, HDI PCB. Cares about customer’s benefit with high quality, high efficiency and lower cost is the best
1. Patch device spacing This article sorts out some details that need to be paid attention to in Layout, let’s see whether you know them all !The spacing
Compare ceramic PCB materials such as alumina and aluminum nitride with conventional FR-4, including rigidity, insulation, thermal performance, copper adhesion, reliability, manufacturing complexity and the main factors that
What matters should be paid attention to in the processing of medical electronic SMT patches, medical electronic products have their own special requirements: Whether it is medical testing
Practical methods for locating and preventing PCB short circuits, covering visual inspection, multimeter checks, net tracing, sectional isolation, BGA and small-component risks, solder-mask controls, process discipline and specialist
Earphone and Headphone manufacturers all tend to be specialized in a certain niche. While they may cover one or more categories, you should only be on the lookout
Important factors to consider include comfort, audio quality, noise cancelation, and roam range. Whether you’re looking for a device with long battery life or one with ultra-comfortable design,
Reflow soldering is an indispensable manufacturing stage in PCBASMT patch processing, and reflow soldering will continue to endanger the soldering quality of SMT patch processing. Nowadays, most of
SMT patch processing term explanation: what is BOM, DIP, SMT, SMD In the 1980s, the SMT production process became more and more perfect. The mass production and manufacture
Although PCB is already well-known, it can even be said that we deal with it every day. So, what exactly is it? How is it produced? How many
The PCB is made of different components and a variety of complex process technologies. Among them, the structure of the PCB circuit board has a single-layer, double-layer, and
The most common problem with headphones is with the plug. That’s the part that goes into your phone, computer, or sound system. It’s also the part that’s tugged
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