Stackup Engineering
Material, layer count, dielectric thickness and copper weights selected with your fabricator and performance targets in mind.
ADVANCED PCB DESIGN
HDI PCB Design
High-density interconnect design engineered for compact size, reliable signal performance and production-ready manufacturability.
MicroviaLaser-drilled interconnects
1+N+1Flexible HDI stackups
Fine PitchBGA escape routing
DFM ReadyFabrication-verified output
More function in less space
HDI layouts built around real manufacturing limits
HDI design is more than fitting smaller traces onto a board. We coordinate stackup, microvia structure, impedance, power integrity and BGA fan-out from the beginning—reducing redesign risk while improving density and electrical performance.
Microvia • Via-in-pad • Fine-line routing
Core design capabilities
From architecture to production data
Microvia Architecture
Stacked, staggered and via-in-pad structures planned for reliability, routing density and manufacturability.
Fine-Pitch BGA Fan-Out
Optimized escape routing for dense BGAs, CSPs and compact packages while protecting return paths.
Signal & Power Integrity
Controlled impedance, reference-plane continuity and power distribution considered throughout placement and routing.
DFM / DFA Review
Clearance, annular ring, solder-mask, assembly access and fabrication constraints checked before release.
Complete Documentation
Gerber or ODB++, drill data, stackup, fabrication drawings and assembly files prepared for a clean handoff.
HDI structure options
Select the right architecture for your product
The final structure is confirmed with the manufacturer according to board thickness, aspect ratio, reliability targets and cost.
1+N+1 HDI
One sequential build-up layer per side; a practical choice for moderate density and fine-pitch escape.
2+N+2 / Multi-step HDI
Additional build-up layers for higher routing density, complex BGAs and reduced board area.
Stacked or Staggered Microvias
Chosen according to routing demand, copper fill, reliability and fabrication capability.
Via-in-Pad, Filled & Capped
Supports compact component footprints, thermal paths and direct BGA escape routing.
HDI PCB design case studies
Representative HDI projects engineered for density and production
Each project begins with package geometry, mechanical limits and fabrication capability—then builds the stackup, microvia strategy and routing rules around those constraints.
01Fine-pitch BGACompact BGA Control Mainboard
A dense controller platform combining fine-pitch processing, memory, power conversion and multiple high-speed interfaces.
Design challengeEscape a dense BGA inside a restricted board outline without disrupting signal return paths or power delivery.
HDI approach1+N+1 build-up, filled via-in-pad, controlled BGA fan-out and reference-plane-aware layer transitions.
02Design workflowSchematic-to-Layout Development
A complete PCB development workflow translating system requirements and schematics into a dense, manufacturing-ready board design.
Design challengeCoordinate component selection, connectivity, placement and high-density routing while keeping the design reviewable and production-ready.
HDI approachConstraint-driven schematic capture, stackup planning, fine-pitch fan-out and continuous DFM checks from layout through release.
03Dense routingHigh-Density Multilayer Layout
A complex multilayer PCB layout with fine-pitch footprints, dense interconnects and tightly coordinated routing channels.
Design challengeRoute a high connection count within a fixed board outline while maintaining clearance, reference continuity and assembly access.
HDI approachMicrovia-assisted escape routing, layer-by-layer channel planning, functional zoning and fabrication-rule validation.
These examples illustrate representative project types and engineering approaches. Details are adapted to protect customer confidentiality.
Design workflow
A controlled route from requirements to release
Requirements and component review
Stackup and design-rule definition
Placement and BGA escape planning
Routing, SI / PI and DFM checks
Documentation and manufacturing release
Applications
Designed for compact, performance-critical products
TelecommunicationsHigh-speed modules, RF systems and network hardware.
Automotive ElectronicsCompact control, sensing and connectivity platforms.
Medical DevicesSpace-constrained electronics requiring disciplined documentation.
Industrial & IoTDense embedded control, edge computing and smart devices.
Frequently asked questions
Planning an HDI design
When should I consider HDI instead of a conventional multilayer PCB?
HDI is useful when fine-pitch components, limited board area, high interconnect density or electrical performance make conventional through-via routing impractical.
Can you coordinate the stackup with my preferred PCB manufacturer?
Yes. We can work with your approved fabricator or coordinate with Excel Circuit manufacturing so the design rules and released stackup match real production capability.
What files are needed to start?
Please provide schematics, BOM, mechanical constraints, component datasheets, interface requirements and any preferred layer-count or impedance targets.
Make your HDI design production-ready
Share your requirements with our engineering team for a practical review of stackup, density, signal performance and manufacturability.
Discuss Your HDI Project