HIGH-SPEED PCB ENGINEERING

Signal Integrity & Power Integrity Analysis

Simulation-driven SI / PI analysis that identifies risk early, protects design margins and supports reliable high-speed hardware.

Pre-LayoutArchitecture validation
Post-LayoutReal routing verification
SI + PIConnected system view
ActionableEngineering recommendations

Validate before hardware

Turn simulation results into practical design decisions

Fast interfaces and dense power networks leave little room for guesswork. Excel Circuit evaluates interconnect behavior, return paths, impedance, crosstalk and power distribution, then translates the findings into routing, stackup, termination and decoupling recommendations your layout team can use.

EYE • IMPEDANCE • NOISE • MARGIN

Analysis capabilities

Engineering coverage across signal and power domains

SI

Impedance & Reflection

Transmission-line behavior, discontinuities, termination strategy and topology evaluated against interface targets.

XT

Crosstalk Analysis

Aggressor-victim coupling assessed to guide spacing, layer assignment and reference-plane strategy.

EY

Eye Diagram & Timing

Jitter, loss, setup and hold margins reviewed for critical serial and parallel interfaces.

PD

Power Delivery Network

Target impedance, resonances and decoupling effectiveness analyzed across the relevant frequency range.

DC

DC Drop & Current Density

Voltage drop, copper loading and current bottlenecks identified before they become thermal or reliability issues.

EM

Return Path & EMI Risk

Reference transitions, plane splits and current loops reviewed to reduce emissions and susceptibility risk.

When to analyze

Support before and after PCB layout

Pre-Layout Analysis

Stackup and impedance planning
Topology and termination comparison
Routing-rule and spacing definition
Decoupling strategy optimization
Design-margin assessment

Post-Layout Verification

Extracted interconnect simulation
Eye diagram and timing review
Crosstalk and return-path checks
PDN and voltage-drop validation
Prioritized corrective actions

Analysis workflow

A clear path from inputs to recommendations

Requirements and interface review
Model, stackup and constraint setup
Simulation and sensitivity analysis
Engineering review and optimization
Report, recommendations and sign-off

Typical deliverables

Results your engineering team can act on

Simulation PlotsWaveforms, eye diagrams, impedance and frequency-domain results.
Risk SummaryCritical issues prioritized by performance and production impact.
Design GuidanceRecommended stackup, routing, termination and decoupling changes.
Review PackageAssumptions, models, conclusions and supporting engineering notes.

Frequently asked questions

Planning SI / PI analysis

Which interfaces typically benefit from SI analysis?

Common examples include DDR, PCIe, USB, Ethernet, HDMI, MIPI, LVDS, SerDes and other fast clock or data interfaces where interconnect behavior affects margin.

What files should I provide?

For pre-layout work, schematics, stackup targets, component models and interface requirements are useful. Post-layout analysis typically also requires PCB design data, actual stackup and routing constraints.

Can the analysis be combined with PCB design?

Yes. Integrating simulation with our PCB design workflow allows stackup, placement and routing decisions to be optimized earlier and verified again before release.

Build confidence into every high-speed interface

Share your schematic, stackup and design data for a focused review of signal margin, power stability and layout risk.

Discuss Your SI / PI Project

Purchasing FAQ

SI / PI Analysis Frequently Asked Questions

Practical answers about files, schedule, engineering support, production coordination and confidentiality.

What is the typical lead time for SI / PI Analysis?

Lead time depends on design maturity, complexity, quantity, material or component availability, testing scope, and how quickly engineering questions are resolved. We confirm the schedule after reviewing your files; urgent prototype or quick-turn options can be discussed where the required process and materials permit.

Which EDA tools and file formats are supported?

We can review common production outputs such as Gerber and ODB++, as well as native EDA data when agreed during the file review. Because library versions, third-party models and tool releases vary, tell us the software and version used before transfer so we can confirm the working format or recommend a neutral export.

Can you handle an existing design or previous revision?

Yes. We can work from an existing design, production package or previous revision. We first check completeness, revision control and the requested scope, then identify any missing data, manufacturability risks or changes that need your approval before work begins.

How is design confidentiality protected?

Project files are limited to personnel and qualified partners who need them for quotation and delivery. Excel Circuit uses reasonable technical and organizational safeguards, does not publish customer designs without permission, and can work under a mutually agreed NDA. Your signed NDA or project agreement controls where it provides specific protections.

Final scope, price and lead time are confirmed after engineering review of your current files and requirements.

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