Thermally efficient MCPCB and IMS solutions designed to move heat away from critical components and improve service life.
Our engineering and production teams combine practical DFM support with controlled processes to help your PCB move smoothly from data review to final inspection.
Aluminum and other metal-core structures provide a direct, efficient path for heat dissipation.
Material selection balances dielectric strength, thermal conductivity and mechanical reliability.
Controlled drilling, imaging and surface finishing deliver repeatable results for LED and power products.
| Core material | Aluminum / metal core |
|---|---|
| Structure | Single layer and multilayer options |
| Dielectric | Thermally conductive insulation |
| Copper weight | 1–4 oz typical |
| Surface finish | HASL, ENIG, OSP |
| Profile | Routing, V-score and custom shapes |
Each project is reviewed against its electrical, thermal, mechanical and schedule requirements.
Send your design files and requirements. Our team will review the project and provide a clear, competitive quotation.
Purchasing FAQ
Practical answers about files, schedule, engineering support, production coordination and confidentiality.
For a Metal Core PCB Manufacturing quotation, send Gerber or ODB++ data, NC drill files, fabrication drawing, layer stackup, material and copper requirements, surface finish, controlled-impedance details, quantity, and required delivery date.
Lead time depends on design maturity, complexity, quantity, material or component availability, testing scope, and how quickly engineering questions are resolved. We confirm the schedule after reviewing your files; urgent prototype or quick-turn options can be discussed where the required process and materials permit.
Gerber and ODB++ are the preferred neutral production formats. If your source data is in a native EDA tool, tell us the software and version; we will confirm compatibility or ask for a controlled Gerber/ODB++ export, drill data, drawings and other release files.
Yes. We can work from an existing design, production package or previous revision. We first check completeness, revision control and the requested scope, then identify any missing data, manufacturability risks or changes that need your approval before work begins.
Yes, SI/PI analysis can be coordinated when manufacturing or assembly risk depends on controlled impedance, return paths or power integrity. It is a separate engineering scope and requires suitable design data, stackup information, models and acceptance criteria.
Yes. Excel Circuit can coordinate fabrication, component sourcing, PCB assembly, inspection, testing and related box-build work as one project. The quotation states which stages are included, which materials are consigned, and the approvals needed before production.
Project files are limited to personnel and qualified partners who need them for quotation and delivery. Excel Circuit uses reasonable technical and organizational safeguards, does not publish customer designs without permission, and can work under a mutually agreed NDA. Your signed NDA or project agreement controls where it provides specific protections.
Final scope, price and lead time are confirmed after engineering review of your current files and requirements.