HDI PCB Manufacturing for Compact Electronics
High-density interconnect manufacturing with microvias, sequential lamination and fine-line capability for smaller, lighter and more capable products.
Request a PCB Quote →Built for performance, quality and repeatability
Our engineering and production teams combine practical DFM support with controlled processes to help your PCB move smoothly from data review to final inspection.
Microvia Technology
Laser-drilled microvia structures reduce routing distance and enable higher connection density for compact layouts.
Sequential Lamination
Laser build-up: 1–5 stages for prototypes, subject to engineering review; 1–3 stages for small / medium batches.
Design Support
DFM review focuses on pad geometry, BGA fanout design, via structures, stack-up and manufacturability before release.
Core manufacturing specifications
| HDI structure | Laser build-up: 1–5 stages for prototypes, subject to engineering review; 1–3 stages for small / medium batches. |
|---|---|
| Via technology | Microvia, blind and buried via |
| Interconnect | Via-in-pad options |
| Finish | ENIG, immersion silver, OSP |
| Application pitch | Fine-pitch BGA support |
| Quality | AOI, X-ray and electrical test |
Designed for demanding products
Each HDI and fine-pitch BGA project is reviewed against its electrical, thermal, mechanical and schedule requirements.
- Mobile devices
- Wearable electronics
- Medical instruments
- Compact IoT products
