What is BOM DIP SMT SMD?

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SMT patch processing term explanation: what is BOM, DIP, SMT, SMD

In the 1980s, the SMT production process became more and more perfect. The mass production and manufacture of components used for surface mounting technology was greatly reduced. Various types of equipment with good technical performance and low prices were successively available. Electronic equipment assembled by SMT is available. Small size, good performance, complete functions, and low price advantages, so SMT, as a new generation of electronic assembly technology, is widely used in aviation, aerospace, communications, computers, medical electronics, automobiles, office automation, household appliances and other fields The electronic equipment is installed in the United States.

Next, let’s take a look at the explanation of SMT patch processing terms: what is BOM, DIP, SMT, and SMD.

SMT chip processing

What is BOM?

The bill of materials (BillofMaterial, BOM) is a document that describes the product structure by data type is the bill of materials. The SMT processing BOM includes the material name, usage, and placement position number. BOM is an important link in placement machine programming and IPQC determination. DIP package (DualIn-linePackage) is also called dual in-line package technology, which refers to integrated circuit chips packaged in dual in-line package. Most small and medium-sized integrated circuits use this package type, and the number of pins is usually not Over 100. The DIP packaged CPU chip has two rows of pins and needs to be inserted into a chip socket with DIP structure.

What is SMT?

Surface mount technology, called “SurfaceMountTechnology” in English, or SMT for short, is a circuit assembly technology that attaches and solders surface mount components to the required positions on the surface of the printed circuit board. Specifically, it is to first apply solder paste on the printed circuit board, and then accurately place the surface layer components on the solder paste-coated pads, and heat the printed circuit board until the solder paste melts and cools down. After that, the interconnection between the component and the printed circuit board is completed.

What is SMD?

SMD surface mount devices (SurfaceMountedDevices), “In the initial stage of electronic circuit board production, the via assembly is completely completed by manpower. After the first batch of automated machines are launched, they can place some simple pin components, but cumbersome components Hand-made placement is still required for wave soldering. Surface-layer SMD components were introduced about twenty years ago, and a new era has been created since then. From passive components to active components and integrated circuits, they finally become surface-layer SMD components. The device (SMD) can be assembled by pick-and-place machinery and equipment. For a long period of time, everyone thinks that all pin components can finally be packaged in SMD.
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What is BOM DIP SMT SMD?

SMT patch processing term explanation: what is BOM, DIP, SMT, SMD In the 1980s, the SMT production process became more and more perfect. The mass production and manufacture of components used for surface mounting technology was greatly reduced. Various types of equipment with good technical performance and low prices were successively available. Electronic equipment assembled by SMT is available. Small size, good performance, complete functions, and low price advantages, so SMT, as a new generation of electronic assembly technology, is widely used in aviation, aerospace, communications, computers, medical electronics, automobiles, office automation, household appliances and other fields The electronic equipment is installed in the United States. Next, let’s take a look at the explanation of SMT patch processing terms: what is BOM, DIP, SMT, and SMD.

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