Featured Article
Embedded & FPGA PCB Design: From Architecture to Reliable Bring-Up
A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
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A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
Read Featured Article
To export Gerber files from Altium Designer for PCB manufacturing, open the approved PCB document and use File » Fabrication Outputs » Gerber Files. Configure Gerber or Gerber
Before sending a PCB design for manufacturing, verify that the fabrication package contains the correct copper, solder mask, silkscreen, board outline and NC drill data. Confirm that the
Engineering guidelines for high-current PCB layout covering copper paths, via arrays, switching loops, heat spreading, safety spacing and manufacturing.
Engineering guidelines for FPGA power integrity, PDN design, decoupling placement, BGA power delivery, plane transitions, sequencing and PI validation.
Engineering guide to 50-ohm RF PCB traces covering microstrip, stripline, coplanar waveguide, stack-up variables, connector transitions and fabrication tolerance.
An engineering guide to PCB stackup design covering layer functions, reference planes, power distribution, materials, controlled impedance, via architecture, construction balance and manufacturing DFM.
Engineering-focused DDR PCB routing guidelines covering topology, timing budgets, byte-lane constraints, length matching, impedance, return paths, SI/PI and manufacturing review.
An engineering guide to BGA fanout covering escape-channel planning, dog-bone routing, via-in-pad, microvias, stack-up coordination, return paths, power delivery and manufacturing DFM.
A practical engineering guide to Embedded & FPGA PCB design, from architecture and power sequencing to DDR routing, SI/PI verification, DFM, and board bring-up.
Engineering guide to via-in-pad PCB design covering fine-pitch BGA escape, microvias, VIPPO filling and capping, soldering risk, cost and DFM.
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