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Embedded & FPGA PCB Design: From Architecture to Reliable Bring-Up
A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
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PCB laminates, copper, dielectrics, ceramic substrates, finishes and stackups.
A practical engineering guide covering architecture, power sequencing, DDR routing, SI/PI verification, DFM, and reliable board bring-up.
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Engineering guide to 50-ohm RF PCB traces covering microstrip, stripline, coplanar waveguide, stack-up variables, connector transitions and fabrication tolerance.
An engineering guide to PCB stackup design covering layer functions, reference planes, power distribution, materials, controlled impedance, via architecture, construction balance and manufacturing DFM.
A practical engineering guide to RF PCB layout, controlled impedance, low-loss materials, grounding, transitions, simulation, testing, and manufacturable high-frequency designs.
This article will take you from a beginner’s perspective to quickly understand the commonly used basic concepts in PCB design
Excel Circuit, which specializes in high multilayer PCB, rigid flex PCB, HDI PCB. Cares about customer’s benefit with high quality, high efficiency and lower cost is the best
Compare ceramic PCB materials such as alumina and aluminum nitride with conventional FR-4, including rigidity, insulation, thermal performance, copper adhesion, reliability, manufacturing complexity and the main factors that
The PCB is made of different components and a variety of complex process technologies. Among them, the structure of the PCB circuit board has a single-layer, double-layer, and
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